Photoresist edge bead removal measurement

Details Photoresist edge bead removal measurement Photoresist edge bead removal measurement

2007-03-27

2007-03-27

Bella, Matthew C. (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C438S016000, C250S492200, C702S155000

Reexamination Certificate

active

10890933

ABSTRACT:
An edge bead removal measurement method includes determining an edge of a wafer about a circumference of the wafer. A location of a wafer notch on the edge of the wafer is determined. A location of a center of the wafer is determined. A distance from the edge of the wafer to an edge bead removal line about the circumference of the wafer is determined.

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A copy of PCT Search Report mailed May 4, 2006 (10 pgs.).

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