Photoresist compositions of controlled dissolution rate in alkal

Details Photoresist compositions of controlled dissolution rate in alkal Photoresist compositions of controlled dissolution rate in alkal

1985-12-17

1990-12-25

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Diazo reproduction, process, composition, or product

Composition or product which contains radiation sensitive...

430193, 430197, 430270, 430325, 430326, 430330, G03F 7012, G03F 7023, G03F 7004

Patent

active

049802640

ABSTRACT:
A photoresist composition is disclosed which is a mixture of a photoactive compound and an alkali soluble resin binder comprises of an unsaturated dicarboxylic acid esterified polymeric material, such as a phenolic resin containing a plurality of acid esterifiable groups esterified with an unsaturated dicarboxylic acid anhydride having the formula ##STR1## wherein R.sub.1 and R.sub.2 are independently selected from hydrogen and alkyl groups containing 1 to 3 carbon atoms, R.sub.3 and R.sub.4 are alkylene groups containing 1 to 3 carbon atoms and x and y are either 0 or 1.

REFERENCES:
patent: 3802885 (1974-04-01), Lawson
patent: 3869292 (1975-03-01), Peters
patent: 4009033 (1977-02-01), Bakos et al.
patent: 4108666 (1978-08-01), Hayashi et al.
patent: 4115128 (1978-09-01), Kita
patent: 4442195 (1984-04-01), Yamamoto et al.
patent: 4524121 (1985-06-01), Gleim et al.
patent: 4551409 (1985-11-01), Gulla et al.
patent: 4564575 (1986-01-01), Perreault et al.
DeForest, W. S., "Photoresist Materials and Processes", McGraw-Hill Book Co., 1975, pp. 47-59.

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