Photoresist compositions

Details Photoresist compositions Photoresist compositions

1998-12-21

2000-10-31

Berman, Susan W.

Coating processes

Direct application of electrical, magnetic, wave, or...

Polymerization of coating utilizing direct application of...

427520, 522 79, 522 35, 522111, 522146, 525391, 525396, 525401, 525404, 525407, 525471, 4302701, 4302801, G03F 7038, C08L 6310, C08L 6304, C08L 7112

Patent

active

061399205

ABSTRACT:
Disclosed is a composition comprising a blend of (a) a thermally reactive polymer selected from the group consisting of resoles, novolacs, thermally reactive polyarylene ethers, and mixtures thereof; and (b) a photoreactive epoxy resin that is photoreactive in the absence of a photocationic initiator.

REFERENCES:
patent: 2125968 (1938-08-01), Theimer
patent: 3367914 (1968-02-01), Herbert
patent: 3455868 (1969-07-01), D'Alessandro
patent: 3914194 (1975-10-01), Smith
patent: 4086209 (1978-04-01), Hara et al.
patent: 4110279 (1978-08-01), Nelson et al.
patent: 4435496 (1984-03-01), Walls et al.
patent: 4623558 (1986-11-01), Lin
patent: 4667010 (1987-05-01), Eldin
patent: 4739032 (1988-04-01), Jones
patent: 4908405 (1990-03-01), Bayer et al.
patent: 5268444 (1993-12-01), Jensen et al.
patent: 5336720 (1994-08-01), Richards
patent: 5438082 (1995-08-01), Helmer-Metzmann et al.
patent: 5449704 (1995-09-01), Thompson et al.
patent: 5561202 (1996-10-01), Helmer-Metzmann et al.
patent: 5578417 (1996-11-01), Noguchi et al.
patent: 5681888 (1997-10-01), Nomura et al.
patent: 5738799 (1998-04-01), Hawkins et al.
patent: 5739254 (1998-04-01), Fuller et al.
patent: 5753783 (1998-05-01), Fuller et al.
patent: 5761809 (1998-06-01), Fuller et al.
patent: 5843259 (1998-12-01), Narang et al.
patent: 5849460 (1998-12-01), Kawai et al.
patent: 5958995 (1999-09-01), Narang et al.
Daly, "Chloromethylation of Condensation Polymers Containing an Oxy-1,4-Phenylene Backbone," Polymers Preprints (1979), vol. 20, No. 1, pp. 835-837.
Camps, "Chloromethylstyrene: Synthesis, Polymerization, Transformations, Applications," JMS-Rev. Macromol, Chem. Phys., C22(3), 343-407 (1982-1983).
Tabata, "Pulse Radiolysis Studies on the Mechanism of the High Sensitivity of Chloromethylated Polystyrene as an Electron Negative Resist," 1984 pp. 287-288.
Jurek, "Deep UV Photochemistry of Copolymers of Trimethylsilymethyl Methacrylate and Chloromethylstyrene," Polymer Preprints, 1988, pp. 546-547.
Hergenrother, "Poly(arylene ethers)," Polymer, 1988, vol. 29, Feb.
Havens, "Ethynyl-Terminated Polyarylates: Synthesis and Characterization," Journal of Polymer Science: Polymer Chemistry Edition, vol. 22 (1984), pp. 3011-3025.
Hendricks, "Flare, A Low Dielectric Constant, High Tg, Thermally Stable Poly(Arylene Ether) Dielectric for Microelectronic Circuit Interconnect Process Integration: Synthesis, Characterization, Thermomechanical Properties, and Thin-Film Processing Studies," Polymer Preprints 37(1) 150 (1996), vol. 37, No. 1, Mar. 1996, pp. 150-151.
Zupancic, "Styrene Terminated Resins as Interlevel Dielectrics for Multichip Modules," 1991, pp. 178-179.
Percec, "Functional Polymers and Sequential Copolymers by Phase Transfer Catalysis, 2a)," Makromal Chem., 1984, pp. 1867-1880.
Percec, "Functional Polymers and Sequential Copolymers by Phase Transfer Catalysis, 3a)," Markonal Chem., 1984, pp. 2319-2336.
Percec, "Functional Polymers and Sequential Copolymers by Phase Transfer Catalysis 4. A New and Convenient Synthesis of p- and m-Hydrozymethylphenylacetylene," Polymer Bulletin 10, 223-230, 1983.
Amato, "A New Preparation of Chloromethyl Methyl Ether Free of Bis(chloromethyl) Ether," 1979 Georg Thieme Publishers.
McKillop, "A Simple and Inexpensive Procedure for Chloromethylation of Certain Aromatic Compounds," Tetrahedron Letters, vol. 24, No. 18, 1983, pp. 1933-1936.
Tepenitsyna, "Synthesis of Intermediates for Production of Heat Resistant Polymers (Chloromethylation of Diphenyl Oxide)," Zhurnal Prikladnoi Khimii, vol. 40, No. 11, Nov., 1967, pp. 2540-2546.
Roberts-McDaniel, "Poly(Arylene Ether-co-imidazole)s as Toughness Modifiers for Epoxy Resins," Polymer Preprints, pp. 543-544.

Affiliated with

Also associated with

Rating

Photoresist compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photoresist compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photoresist compositions will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2048496