Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...
Patent
1979-07-27
1981-05-19
Bowers, Jr., Charles L.
Radiation imagery chemistry: process, composition, or product th
Diazo reproduction, process, composition, or product
Composition or product which contains radiation sensitive...
430167, 430197, 430139, 430510, 430512, G03C 160, G03C 170, G03C 171
Patent
active
042686032
ABSTRACT:
The invention presents a novel photoresist composition used in the photoetching in the manufacture of various electronic semiconductor devices, in which the phenomenon of halation adversely affecting the fidelity of the etching patterns can be very much reduced. The photoresist composition of the invention comprises (a) a cyclized rubber, (b) a bisazide compound, (c) a photoextinction agent which is a 4-phenylazo-N,N-disubstituted aniline compound or a related bis derivative of biphenyl or diphenyl ether, and (d) a fluorescent agent which is a N,N'-di(substituted methylene) derivative of a phenylenediamine or hydrazine.
With this formulation, the loss of ultraviolet absorption at about 360 nm caused by the photodecomposition of the component (b) is compensated for by the absorption of the photodecomposition product of the component (c) while the component (d) has no absorption at about 360 nm but emits a fluorescence in the range of 380 to 450 nm.
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Clecak, N. et al., "Negative Photoresist", IBM Technical Disclosure Bulletin, vol. 13, No. 5, 10/1970, p. 1274.
Bowers Jr. Charles L.
Tokyo Ohka Kogyo Kabushiki Kaisha
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