Photoresist composition and printed circuit boards and packages

Radiation imagery chemistry: process – composition – or product th – Imaged product – Multilayer

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

430280, 430 18, 430271, 430275, 522170, 428195, 428201, 428901, 428209, 428332, 428220, 174 685, 361379, 361412, G03C 172, A01B 900, H02B 100

Patent

active

048822450

ABSTRACT:
A photocurable composition which is useful as a permanent resist in the manufacture of printed circuit boards and packages of such boards comprises a multifunctional epoxidized resin, a reactive diluent, a cationic photoinitiator and, optionally, an exposure indicator, a coating aid and a photosensitizer.

REFERENCES:
patent: 3794576 (1974-02-01), Watt
patent: 3826650 (1972-08-01), Schlesinger
patent: 3900325 (1975-08-01), Christensen et al.
patent: 4113497 (1978-09-01), Schlesinger
patent: 4138255 (1979-02-01), Crivello
patent: 4173476 (1979-11-01), Smith et al.
patent: 4175963 (1979-11-01), Crivello
patent: 4186108 (1980-01-01), Carlson et al.
patent: 4193799 (1980-03-01), Crivello
patent: 4227978 (1980-10-01), Barton
patent: 4231886 (1980-11-01), Carlson
patent: 4231951 (1980-11-01), Smith et al.
patent: 4237216 (1980-12-01), Skarvinko
patent: 4245029 (1981-01-01), Crivello
patent: 4272607 (1981-06-01), Tsukada et al.
patent: 4273668 (1981-06-01), Crivello
patent: 4299938 (1981-11-01), Green et al.
patent: 4308118 (1981-12-01), Dudgeon
patent: 4318766 (1982-03-01), Smith
patent: 4374751 (1983-02-01), Dudgeon
patent: 4378277 (1983-03-01), Smith
patent: 4394403 (1983-07-01), Smith
patent: 4429034 (1984-01-01), Keane et al.
patent: 4518676 (1985-05-01), Irving
patent: 4659649 (1987-04-01), Dickinson

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Photoresist composition and printed circuit boards and packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photoresist composition and printed circuit boards and packages , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photoresist composition and printed circuit boards and packages will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1425565

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.