Photoresist composition and article containing 1,2-quinonediazid

Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...

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430191, 430192, 4302711, 4302721, 4302751, 4302771, 4302781, G03F 7023, G03C 161

Patent

active

056331118

ABSTRACT:
A positive type or negative type photoresist composition for fine processing having excellent resolution, sensitivity, adhesive-ness and developability comprising:
(a) an alkali soluble resin or a resin having anti-alkali dissolution groups in the molecules thereof,
(b) a light-sensitive compound, and
(c) at least one organic compound selected from the group consisting of organic phosphorus acid compounds and esters thereof in an amount of 0.001 to 10% by weight based on a weight of the resin. In addition, the present invention is directed to an etching method utilizing the positive type or negative type photoresist composition.

REFERENCES:
patent: 3404003 (1968-10-01), Steppan
patent: 4963463 (1990-10-01), Koshiba et al.
patent: 4968582 (1990-11-01), Tranjan et al.
patent: 5114827 (1992-05-01), Tranjan et al.
patent: 5143814 (1992-09-01), Pampalone
patent: 5213941 (1993-05-01), Platzer

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