Photoresist application for a circlet wafer

Details Photoresist application for a circlet wafer Photoresist application for a circlet wafer

1998-06-01

2000-08-22

Edwards, Laura

Coating apparatus

With means to centrifuge work

118 56, 118316, 118315, 118313, 118319, 118320, 118321, 118323, B05C 1102, B05C 1300, B05C 906, B05B 302

Patent

active

061066184

ABSTRACT:
Apparatus and method for depositing fluids on both sides of a semiconductor wafer that has a central opening are provided. In one aspect, the apparatus includes a mandrel for holding the wafer and a motor coupled to the mandrel and that is operable to rotate the mandrel. The apparatus also includes means for dispensing a first volume of fluid on the semiconductor wafer and a second volume of fluid on the semiconductor wafer. According to the method, a semiconductor wafer is coupled to a rotatable mandrel. The mandrel is rotated to spin the semiconductor wafer and a semiconductor processing fluid is sprayed on the first and second sides of the semiconductor wafer.

REFERENCES:
patent: 5393349 (1995-02-01), Ohkase
patent: 5626913 (1997-05-01), Tomoeda et al.
Stanley Wolf and Richard N. Tauber, Silicon Processing for the VLSI Era, Volume 1-Process Technology; pp. 407-409, and 429-437; 1986.

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