Photoreactive hot-melt adhesive composition

Details Photoreactive hot-melt adhesive composition Photoreactive hot-melt adhesive composition

2007-05-22

2007-05-22

McClendon, Sanza L. (Department: 1711)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

C522S170000, C522S104000, C522S134000, C522S143000, C522S158000, C522S178000, C522S179000, C522S181000, C428S3550EP, C427S207100, C427S208000

Reexamination Certificate

active

11244960

ABSTRACT:
It is an object to provide a photoreactive hot-melt adhesive composition which exhibits high adhesive strength immediately after combination of adherends and excellent bond strength after completion of curing and provides a highly durable bonded laminate.A photoreactive hot-melt adhesive composition containing:(a) a bisphenol F epoxy resin that assumes a solid form at ordinary temperature;(b) at least one compound selected from the group consisting of a compound represented by the following formula (1), a copolymer of tetramethylene oxide and ethylene oxide and a copolymer of tetramethylene oxide and propylene oxide; and(c) a cationic photoinitiator;in-line-formulae description="In-line Formulae" end="lead"?R1-(OR2)n—OR3  Formula (1)in-line-formulae description="In-line Formulae" end="tail"?(In the formula, R1 and R3 independently represent any of a hydrogen atom, a glycidyl group, and a monofunctional substituted or unsubstituted hydrocarbon group having 1–8 carbon atoms; R2 represents a bifunctional, substituted or unsubstituted hydrocarbon group having 2–8 carbon atoms; and n is an integer of 2 or larger. In (OR2)n, R2's of OR2's may be all identical to or different from each other).

REFERENCES:
patent: 6015865 (2000-01-01), Blank et al.
patent: 0276716 (1988-08-01), None
patent: 11043661 (1999-02-01), None

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