Photopolymerizable compositions for encapsulating microelectroni

Details Photopolymerizable compositions for encapsulating microelectroni Photopolymerizable compositions for encapsulating microelectroni

1998-08-07

2000-08-08

Berman, Susan W.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26427217, 264494, 264496, 427572, 427519, 522 13, 522 24, 522 43, 522 64, 522 81, 522 83, 522100, 522103, 522170, B29B 1308, B29C 3508, C08F 400, C08J 706

Patent

active

060997834

ABSTRACT:
A novel method for producing thick composite parts based upon photopolymerizable compositions is disclosed. Also disclosed are novel methods for encapsulation of microelectronic devices based upon novel photopolymerizable compositions. The constituents of the photopolymerizable mixture comprise a monomer or monomers capable of polymerizing by free radical or cationic mechanisms, and a photoinitiator system which possesses an absorbance characteristic which is effectively reduced, or self-eliminating, upon initiation of the polymerization reaction. Parts having thicknesses up to 2 cm and thicker for varying end use applications are made by photopolymerizing such compositions. In addition, using such compositions composite parts can be made using a reinforcement material such as a glass fiber mat present in an amount by weight of from about 5 to about 70%.

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