Photopolymerizable composition and recording material using...

Details Photopolymerizable composition and recording material using... Photopolymerizable composition and recording material using...

2005-01-25

2005-01-25

Schilling, Richard L. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Microcapsule, process, composition, or product

C430S281100, C430S914000, C430S926000

Reexamination Certificate

active

06846605

ABSTRACT:
The present invention provides a photopolymerizable composition and a recording material using the photopolymerizable composition, which contains a polymerizable compound having an ethylenic unsaturated group, an organic borate and a cationic compound that interacts with the organic borate. The organic borate is represented by the following formula (1) wherein R1represents an alkyl group, R2represents an electron-donating group, R3to R6each represent a hydrogen atom or a substituent, the sum of Hammett's substituent constants σ of R2to R6is 0 to 1, and Z+represents a group that can form a cation. The organic borate has a melting point of no more than 100° C.

REFERENCES:
patent: 5091280 (1992-02-01), Yamaguchi et al.
patent: 5100755 (1992-03-01), Shanklin
patent: 5346801 (1994-09-01), Watanabe et al.
patent: 5945152 (1999-08-01), Purser
patent: 6045974 (2000-04-01), Cunningham et al.
patent: A-52-89915 (1977-07-01), None
patent: A-60-119552 (1985-06-01), None
patent: A-61-123838 (1986-11-01), None
patent: A-3-87827 (1991-04-01), None
patent: A-4-211252 (1992-08-01), None

Affiliated with

Also associated with

Rating

Photopolymerizable composition and recording material using... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photopolymerizable composition and recording material using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photopolymerizable composition and recording material using... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3417037