Photopolymerizable composition

Details Photopolymerizable composition Photopolymerizable composition

1983-09-26

1985-02-26

Sebastian, Leland A.

Compositions

Radiation sensitive

20415916, 20415922, 427 96, 428901, H01L 1300

Patent

active

045016895

ABSTRACT:
A photopolymerizable composition used suitably as a solder resist for a printed circuit board which comprises:

REFERENCES:
patent: 4262072 (1981-04-01), Wendling et al.
patent: 4323591 (1982-04-01), Wendling et al.

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