Photopolymerizable coating and recording materials containing a

Details Photopolymerizable coating and recording materials containing a Photopolymerizable coating and recording materials containing a

1978-12-27

1980-12-16

Bleutge, John C.

Chemistry: electrical and wave energy

Processes and products

Processes of treating materials by wave energy

20415918, 430286, C08F 250

Patent

active

042396093

ABSTRACT:
Photopolymerizable coating and recording materials, such as photopolymer dry film resist materials and photoresist materials, comprising at least one photopolymerizable olefinic compound, which materials contain, as activated photoinitiator system, a carbonyl compound that, when exposed to actinic light, forms free radicals which initiate polymerization, such as benzophenone and benzophenone derivatives, as well as a benzene compound having at least two dichloromethyl groups bound to the benzene nucleus, such as bis(dichloromethyl)-benzene and 2,5-dichloro-1,4-bis(dichloromethyl)benzene, and preferably also a dye which changes color in the presence of acid. The coating and recording materials of the invention exhibit improved curing when exposed to ultraviolet light for the usual periods and can be readily washed out with solvents without any damage to the exposed areas.

REFERENCES:
patent: 3857769 (1974-12-01), McGinniss
patent: 3878075 (1975-04-01), McGinniss
patent: 3988228 (1976-10-01), Newland et al.
patent: 4040923 (1977-08-01), Pacifici et al.
patent: 4043887 (1977-08-01), Pacifici et al.
patent: 4113592 (1978-09-01), Rybny et al.

Affiliated with

Also associated with

Rating

Photopolymerizable coating and recording materials containing a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photopolymerizable coating and recording materials containing a , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photopolymerizable coating and recording materials containing a will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-606652