Photopolymer films containing microencapsulated sensitometric ad

Radiation imagery chemistry: process – composition – or product th – Microcapsule – process – composition – or product

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

430270, 430281, 430935, G03C 168, G03F 716

Patent

active

046364536

ABSTRACT:
Photopolymerizable elements comprising a support, a layer of a photopolymerizable composition and a protective layer, the photopolymerizable layer having in reactive association therewith, e.g., dispersed therein or in contact with the surface, pressure rupturable microcapsules containing therein at least one active component for the photopolymerizable composition, e.g., ethylenically unsaturated compound, sensitizer, photoinitiator, oxygen scavenger, and plasticizer. Processes for the preparation of an activated photopolymerizable element and use are described wherein the microcapsules are ruptured, i.e., prior to imagewise exposure and development. The photopolymerizable elements are useful as color proofs, printing plates, etc.

REFERENCES:
patent: 3219446 (1965-11-01), Berman
patent: 3700439 (1972-10-01), Phillips
patent: 4399209 (1983-08-01), Sanders et al.
patent: 4416966 (1983-11-01), Sanders et al.
patent: 4440846 (1984-04-01), Sanders et al.
patent: 4482624 (1984-11-01), Arney et al.
patent: 4501809 (1985-02-01), Hiraishi et al.
patent: 4532200 (1985-07-01), Arney et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Photopolymer films containing microencapsulated sensitometric ad does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photopolymer films containing microencapsulated sensitometric ad, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photopolymer films containing microencapsulated sensitometric ad will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2355536

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.