Photonics module and alignment method

Details Photonics module and alignment method Photonics module and alignment method

1990-06-19

1991-06-11

Scott, Jr., Leon

Coherent light generators

Particular active media

Semiconductor

372 43, 372 50, H01S 319

Patent

active

050238817

ABSTRACT:
A laser (24) is mounted in predetermined alignment with a monocrystalline mounting member (11) by defining in the mounting member a reference surface (18) that is displaced from a second surface (19). Solder (29) is placed on a second surface such that in its solid form its length and width each significantly exceeds its height. The laser is bonded to the reference surface such that part of the laser overlies the solder and is separated from the solder by a small gap (30). Next, the solder is melted to cause it to gather on the second surface sufficiently to contact an under surface (31) of the laser. The solder is then cooled such that the solder bonds the laser to the silicon mounting member.

REFERENCES:
patent: 4156206 (1979-05-01), Comerford et al.
patent: 4464762 (1984-08-01), Furuya
patent: 4750799 (1988-06-01), Kawachi et al.
patent: 4904036 (1990-02-01), Blonder
"Glass Waveguides on Silicon for Hybrid Optical Packaging," C. H. Henry et al., Journal of Lightwave Technology, vol. 7, No. 10, Oct. 1989, pp. 1530-1539.

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