Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Reexamination Certificate
2006-10-31
2006-10-31
Healy, Brian M. (Department: 2883)
Optical waveguides
With disengagable mechanical connector
Optical fiber to a nonfiber optical device connector
C385S092000, C385S052000, C385S049000, C385S035000, C385S033000
Reexamination Certificate
active
07128476
ABSTRACT:
A photonic integrated chip having low insertion loss and facilitating alignment of the optical fiber with an optical device, preferably a waveguide or optical detector. The photonic integrated chip includes an optical fiber having a substantially spherical lens attached to one end. The device includes an etched via that receives the spherical lens attached to the optical fiber. An optical device is aligned with the via opposite the spherical lens such that light transmitted through the spherical lens is transmitted to the optical device. An anti-reflection coating is preferably applied on the end of the optical device abutting the via and the surface of the spherical lens to reduce scattering and insertion loss during transmission of data from the spherical lens to the optical device. Index matching fluid is alternatively disposed between the spherical lens and the via for this same purpose.
REFERENCES:
patent: 4433898 (1984-02-01), Nasiri
patent: 5293438 (1994-03-01), Konno et al.
patent: 5499311 (1996-03-01), DeCusatis
patent: 5771323 (1998-06-01), Trott
patent: 5940564 (1999-08-01), Jewell
patent: 6137929 (2000-10-01), Rosenberg et al.
patent: 6215925 (2001-04-01), Kaneyama
patent: 6250820 (2001-06-01), Melchior et al.
patent: 6549704 (2003-04-01), Ukrainczyk
patent: 6928226 (2005-08-01), Caracci et al.
Boudreaux Paul John
Satorius Duane Anthony
Ferragut Jennifer P
Healy Brian M.
The United States of America as represented by the National Secu
LandOfFree
Photonic integrated circuit and method of fabricating same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photonic integrated circuit and method of fabricating same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photonic integrated circuit and method of fabricating same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3644575