Photonic-electronic circuit boards

Optical waveguides – Integrated optical circuit

Reexamination Certificate

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Details

C385S129000, C385S130000, C385S131000, C385S132000, C430S054000, C430S056000, C430S057100

Reexamination Certificate

active

07139448

ABSTRACT:
Significant advances in semiconductor microelectronics technologies have resulted in greatly enhanced chip performance. Systems studies have continuously shown that on-board interconnects between chips are the bottleneck in achieving board level performance that is comparable with this chip performance. This invention provides a multiple-layer photonic-electronic circuit board family that solves this interconnect performance problem. Multiple layers of patterned optical channel waveguides and patterned electrical conductors co-exist in a single circuit board structure, with optical vias to transport light between different photonics layers and electrical vias to transport electrical signals and power between different electronics layers. An all-lithographic fabrication technology is used to build the entire board structure with mutually compatible planar processing steps. Novel techniques are used to produce channel optical waveguides connected to in-plane 45 degree turning mirrors and channel optical waveguides connected to optical vias with out-of-plane 45 degree turning mirrors. The mirrors can have either total internal reflection or metallized facets.

REFERENCES:
patent: 4878728 (1989-11-01), Mannschke
patent: 5140149 (1992-08-01), Sakata et al.
patent: 5511142 (1996-04-01), Horie et al.
patent: 6724968 (2004-04-01), Lackritz et al.

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