Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-06-28
2005-06-28
Haran, John T. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S379800, C156S580000, C219S243000, C219S385000
Reexamination Certificate
active
06911108
ABSTRACT:
Photon welding devices of this invention comprise a non-coherent photon source, and a light pipe coupled to the photon source at one end. A thin mask is positioned at another end of the light pipe that defines a weld location for photon delivery. A work piece to be bonded by the device comprises a top layer of transparent plastic and a base layer of absorbing plastic. The thin mask is in the form of a reflective coating positioned on the end of the light pipe over all surfaces that are not in contact with the work piece. A device includes a member that imposes a controlled, compressive force to the work piece while it is being welded and during a short time thereafter. The device also includes a member that maintains a desired alignment of the light pipe, top layer of the work piece, and base layer of the work piece during the bonding cycle.
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Christie Parker & Hale LLP
Haran John T.
Quantum Group Inc.
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