Photomask, photomask superimposition correcting method, and...

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S022000, C430S311000

Reexamination Certificate

active

07906258

ABSTRACT:
In a photomask in which a device pattern, an alignment mark and a superimposition inspection mark are formed on a light transmitting base, each of the alignment mark and the superimposition inspection mark includes a main mark portion, and first and second auxiliary pattern portions. The main mark portion is constituted of one of a space pattern and a line pattern, the pattern having a linear width to be resolved on a photosensitive film formed on a semiconductor wafer, and each of the first and second auxiliary pattern portions includes an auxiliary pattern constituted of one of a repeated pattern of a space pattern and a repeated pattern of a line pattern, the repeated pattern having a linear width not to be resolved on the photosensitive film. The pitch of the repeated pattern is equal to the minimum pitch of the device pattern.

REFERENCES:
patent: 6855997 (2005-02-01), Suwa
patent: 9-102457 (1997-04-01), None
patent: 11-251218 (1999-09-01), None
patent: 2002-64055 (2002-02-01), None
patent: 3371852 (2002-11-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Photomask, photomask superimposition correcting method, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photomask, photomask superimposition correcting method, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photomask, photomask superimposition correcting method, and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2739118

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.