Photolithographically patterned spring contact

Details Photolithographically patterned spring contact Photolithographically patterned spring contact

1995-06-07

1997-03-25

Luebke, Renee S.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

200246, 200275, 324754, 361774, 439591, H01R 903, H05K 114

Patent

active

056138610

ABSTRACT:
A photolithographically patterned spring contact is formed on a substrate and electrically connects contact pads on two devices. The spring contact also compensates for thermal and mechanical variations and other environmental factors. An inherent stress gradient in the spring contact causes a free portion of the spring contact to bend up and away from the substrate. An anchor portion remains fixed to the substrate and is electrically connected to a first contact pad on the substrate. The spring contact is made of an elastic material and the free portion compliantly contacts a second contact pad, thereby electrically interconnecting the two contact pads.

REFERENCES:
patent: 4320438 (1982-03-01), Ibrahim et al.
patent: 4423401 (1983-12-01), Mueller
patent: 4758927 (1988-07-01), Berg
patent: 5121298 (1992-06-01), Sarma et al.
patent: 5152695 (1992-10-01), Grabbe et al.
patent: 5280139 (1994-01-01), Suppelsa et al.
A. E. Bill Corwith, "Probing at Die Level", Advanced Packaging, Jan./Feb. 1995, pp. 26 and 28.
IBM Technical Disclosure vol. 34 No. 7B Dec. 1991.

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