Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-09-20
2005-09-20
Donovan, Lincoln (Department: 2832)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C336S192000, C336S200000, C336S233000, C336S232000, C439S074000, C439S081000
Reexamination Certificate
active
06947291
ABSTRACT:
An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.
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Chua Christopher L.
Fork David K.
Lemmi Francesco
Lu Jeng Ping
Peeters Eric
Donovan Lincoln
Poker Jennifer A.
Walder Jeannette M.
Xerox Corporation
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