Photolithographic mask exhibiting enhanced light...

Plastic and nonmetallic article shaping or treating: processes – With step of making mold or mold shaping – per se

Reexamination Certificate

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Reexamination Certificate

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08052908

ABSTRACT:
A nanophotolithography mask includes a layer of an electrically conductive optically opaque material deposited on a mask substrate in which regular arrays of sub-wavelength apertures are formed. The plasmonic excitation in the layer perforated with the sub-wavelength apertures arrays under the light incident on the mask produces high resolution far-field radiation patterns of sufficient intensity to expose a photoresist on a wafer when propagated to the same. The fill-factor of the mask, i.e., the ratio of the total apertures area to the total mask area, may lead to a significant increase in mask manufacturing throughput by FIB or electron beam “writing”. The mask demonstrates the defect resiliency and ability to imprint coherent clear features of nano dimensions and shapes on the wafers for integrated circuits design.

REFERENCES:
Srituravanich, et al. “Deep subwavelength nanolithography using localized surface plasmon modes of planar silver mask” J. Vac. Sci. Technol. B 23(6), Dec. 2005, p. 2636-2639.
T.W. Ebbesen et al., “Extraordinary optical transmission through sub-wavelength hole arrays”, Nature, vol. 391, Feb. 1998, pp. 667-669.

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