Radiation imagery chemistry: process – composition – or product th – Radiation sensitive product – Identified backing or protective layer containing
Patent
1978-10-04
1980-09-02
Bowers, Jr., Charles L.
Radiation imagery chemistry: process, composition, or product th
Radiation sensitive product
Identified backing or protective layer containing
430937, 430538, G03C 187
Patent
active
042204712
ABSTRACT:
A photographic material comprising a support having on the surface a polypropylene resin component and a hydrophilic colloidal layer on the top surface which are firmly adhered together, is produced by subjecting the support having on the surface a polypropylene resin component to corona discharge, applying thereto a subbing layer comprising (a) at least one water-dispersed polymer latex selected from butadiene-acrylic ester copolymers, polyvinyl chloride and polystyrene, (b) a compound having an ethyleneimino group such as that capable of hardening a colloidal gelatin or casein, and (c) a water-soluble polymer, and providing a hydrophilic protective colloidal layer on said subbing layer.
REFERENCES:
patent: 3582338 (1971-06-01), Yost et al.
patent: 3607345 (1971-09-01), Thomas et al.
patent: 3676189 (1972-07-01), Woodward et al.
patent: 3711284 (1973-01-01), Van Paasschen et al.
patent: 3712812 (1973-01-01), Van Paasschen et al.
patent: 3793029 (1974-02-01), Parkev
patent: 3874880 (1975-04-01), Venor et al.
patent: 3888679 (1975-06-01), Komatsu et al.
patent: 4135932 (1979-01-01), Mann
Date Sukeaki
Ebato Seigo
Bowers Jr. Charles L.
Mitsubishi Paper Mills Ltd.
LandOfFree
Photographic polypropylene coated paper support with corona disc does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photographic polypropylene coated paper support with corona disc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photographic polypropylene coated paper support with corona disc will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1707005