Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...
Patent
1994-05-25
1997-03-04
Sells, James
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With means applying wave energy or electrical energy...
156235, 156238, 1562735, 1562755, 1563071, 1563077, 156540, 4251744, B32B 3100
Patent
active
056075405
ABSTRACT:
A method of photoforming a three-dimensional object, comprising the steps of transferring onto a work table a semi-hardened layer of a photohardenable resin separably supported on a base film, photoforming a hardened layer by exposing the semi-hardened layer, the hardened layer being laminated on a previously hardened layer to photoform the three-dimensional object, and when the hardened layer is photoformed, photoforming a first-region hardened layer forming the three-dimensional object and also a second region hardened layer that is adjacent to the first-region hardened layer through a predetermined space, the first-region hardened layer being supported through a portion of the semi-hardened layer by the second-region hardened layer.
An apparatus for photoforming a three-dimensional object, comprising a transfer unit for transferring onto a work able a semi-hardened layer of a photohardenable resin separably supported on a base film, and an irradiation unit for photoforming a hardened layer by exposing the semi-hardened layer, the hardened layer being laminated on a previously hardened layer to photoform the three-dimensional object.
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Sells James
Teijin Seiki Co. Ltd.
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