Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1981-09-03
1990-06-19
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1563077, 156322, 29831, 29846, 174259, B32B 3126, B65C 925, H05K 320, H05K 302
Patent
active
049350900
ABSTRACT:
A quick-cure laminating process for multi-lamp photoflash arrays includes the application of a curable adhesive to a metallic printed circuit, the positioning of the adhesive-covered printed circuit adjacent a deformable rubber material and a circuit board and the printed circuit and circuit board intermediate a pair of surfaces movable with respect to one another and the moving of said surfaces to exert a compressive force on said printed circuit and circuit board while being heated to a temperature and for a time sufficient to effect attachment of the printed circuit to the circuit board. In another aspect, the circuit board may be of a deformable material, placed in contact with an adhesive-covered printed circuit, compressed and heated to effect attachment of the printed circuit to the circuit board.
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IBM Technical Disclosure Bulletin, vol. 10, No. 8, Jan.-1968, p. 1284-Weikiuger.
Ball Michael W.
Buffton Thomas H.
Falasco L.
Finnegan Martha Ann
GTE Products Corporation
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