Photoelectrochemical wet etching of group III nitrides

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching

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205655, 205666, H01L 21302

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057733694

ABSTRACT:
A method of processing semiconductor films and layers, especially Group III Nitride films, has been achieved, using laser-enhanced, room-temperature wet etching with dilute etchants. Etch rates of a few hundred .ANG./min up to a few thousand .ANG./min have been achieved for unintentionally doped n-type Group III Nitride films grown by MOCVD on a sapphire substrate. The etching is thought to take place photoelectrochemically with holes and electrons generated by incident illumination from 4.5 mW of HeCd laser power enhancing the oxidation and reduction reactions in an electrochemical cell.

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