Photoelectrochemical gold plating process

Chemistry: electrical and wave energy – Processes and products

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204 32S, C25D 502, C25D 712

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active

043990045

ABSTRACT:
A process is described for plating gold on metal surfaces electrically attached to a compound semiconductor. The procedure is particularly valuable where gold is to be in small holes or crevices in semiconductor structure since electroplating on the semiconductor surface is avoided. The process is useful for providing low inductance electrical connection to various parts of semiconductor devices such as to the source in gallium arsenide field-effect transistors.

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patent: 3890215 (1975-06-01), DiLorenzo
patent: 4144139 (1979-03-01), Durkee
patent: 4251327 (1981-02-01), Grenon
J. of the Electrochemical Society, vol. 108, No. 8, Aug. 1961, pp. 790-794.
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J. of the Electrochemical Society, vol. 126, No. 5, May 1979, pp. 855-859.
Soviet Physics, Technical Physics, vol. 21, No. 7, Jul. 1976, pp. 857-859.
Electronics Letters, vol. 12, No. 6, Mar. 18, 1976, pp. 133-134.
Solid-State Electronics, vol. 24, 1981, pp. 337-342.

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