Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2004-07-29
2008-11-25
Gurley, Lynne (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S456000, C257SE21237, C257SE21484
Reexamination Certificate
active
07456051
ABSTRACT:
A photoelectric device grinding process comprising the following steps is disclosed. A wafer comprising a plurality of chip units is provided. Each chip unit has at least a photoelectric device disposed on a surface layer. A dielectric substrate is attached to the wafer with glue having a plurality of spacers therein such that the photoelectric devices face the dielectric layer. The spacers maintain a gap between the dielectric substrate and the wafer. Thereafter, the dielectric substrate surface away from the wafer or the wafer surface away from the dielectric substrate or both is ground. The grinding process is particularly suitable for preventing any possible damage to the photoelectric devices on a wafer.
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patent: 2006/0043555 (2006-03-01), Liu
Chen Chih-Lung
Yee Kuo-Chung
Advanced Semiconductor Engineering Inc.
Gurley Lynne
Jianq Chyun IP Office
Matthews Colleen
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