Photoelectric conversion device and its manufacturing method

Coating processes – Electrical product produced – Welding electrode

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136244, 136258, 427 38, 427 74, B05D 512, H01L 2500

Patent

active

047103973

ABSTRACT:
A method for the manufacture of a semiconductor photoelectric conversion device in which a plurality n of semiconductor elements U.sub.1 to U.sub.n are sequentially formed side by side on a substrate and connected in series one after another. The element U.sub.i (i=1, 1, substrate, a non-single-crystal semiconductor laminate member Q.sub.i on the electrode E.sub.i and a second electrode F.sub.i on the laminate member Q.sub.i. The electrode F.sub.j+1 of the element U.sub.j+1 (j=1, 2, . . . (n-1)) is connected via coupling portion K.sub.j to the first electrode E.sub.j. After the formation of a first conductive layer on the substrate, the electrode E.sub.1 to E.sub.n are provided by forming grooves G.sub.1 to G.sub.n-1 in the first conductive layer through use of a first laser beam. A non-single-crystal semiconductor laminate layer is formed to cover the electrodes E.sub.1 to E.sub.n and the grooves G.sub.1 to G.sub.n-1, after which grooves O.sub.1 to O.sub.n-1 are cut in the laminate layer through use of a second laser beam, forming the laminate members Q.sub.1 to Q.sub.n. The coupling portions K.sub.1 to K.sub.n-1 are provided by forming a second conductive layer which covers the laminate members Q.sub.1 to Q.sub.n and the grooves O.sub.1 to O.sub.n-1. The electrodes F.sub.1 to F.sub.n are provided by forming isolating portions H.sub.1 to H.sub.n-1 in the second conductive layer through use of a third laser beam. The distances between the inner edges of the grooves G.sub.j and O.sub.j and between the inner edges of the groove O.sub.j and the isolating portion H.sub.j are greater than but close to the thickness of the laminate member Q.sub.j.

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