Photoelectric conversion apparatus and method for...

Batteries: thermoelectric and photoelectric – Photoelectric – Panel or array

Reexamination Certificate

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C136S256000, C136S258000, C438S080000, C438S096000, C438S098000, C257S443000, C257S448000

Reexamination Certificate

active

06235982

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a photoelectric conversion apparatus including a substrate and a plurality of unit photoelectric conversion elements formed on the substrate and connected in series, and also relates to a method for manufacturing such a photoelectric conversion apparatus.
BACKGROUND OF THE INVENTION
SCAF (Series Connection through Apertures on Film) type photoelectric conversion apparatus is known as a typical example of photoelectric conversion apparatus in which a plurality of unit photoelectric conversion elements formed on the same substrate are connected in series.
In the SCAF type photoelectric conversion apparatus, a plurality of unit photoelectric conversion elements are formed on, for example, a flexible substrate having an insulating property, such that each of the unit photoelectric conversion elements is composed of a lower electrode, a photoelectric conversion layer consisting of a thin-film semiconductor layer, and an upper electrode, which are laminated in this order on the substrate. By electrically connecting the lower electrode of a certain unit photoelectric conversion element with the upper electrode of its adjacent unit photoelectric conversion element in a repeated manner, namely, by connecting the plural unit photoelectric conversion elements in series, a desired voltage may be established between the lower electrode of the first unit photoelectric conversion element and the upper electrode of the last unit photoelectric conversion element. In order to provide an alternating voltage of 100V as a commercial power source as a result of dc/ac conversion by an inverter, for example, the photoelectric conversion apparatus is desired to produce an output voltage of 100V or higher, and, in an actual apparatus, several tens of unit photoelectric conversion elements are connected in series.
The series connection of the unit photoelectric conversion elements is established by forming electrode layers and photoelectric conversion layer and patterning each of these layers, through a suitable combination of film-forming and patterning processes. A known example of photoelectric conversion apparatus will be now described in which a small number of unit photoelectric conversion elements are connected in series.
FIG.
7
(
a
) is a plan view showing a conventional thin-film solar cell including series-connected electrodes formed on opposite surfaces of a substrate, and FIG.
7
(
b
) is a cross-sectional view taken along lines x-X of FIG.
7
(
b
). In FIG.
7
(
b
), “n” is suffixed to reference numerals that denote adjacent unit photoelectric conversion element and adjacent electrodes.
A large number of unit photoelectric conversion elements are formed on one surface (that will be called “front surface”) of a substrate
1
formed of a flexible insulating material, such that each if unit photoelectric conversion element is composed of a lower electrode layer, photoelectric conversion layer and an upper electrode layer that are laminated on each other. On the other surface (rear surface) of the substrate is formed a rear electrode consisting of a first connecting electrode layer and a second connecting electrode layer that are laminated on each other.
Initially, a lower electrode layer is formed on one surface of the substrate
1
through which connecting holes or apertures H
1
are formed, and a rear electrode layer is formed on the other surface of the substrate
1
. The lower electrode layer and the first connecting electrode layer overlap each other on the inner wall of each connection hole H
1
, so that these layers are electrically connected with each other. The lower electrode layer is subjected to laser beam machining for removing thin strip-like parts of the electrode layer to provide parting lines L
1
, so that the lower electrode layer is divided by the parting lines L
1
into individual lower electrodes
2
e
having a desired shape. Then, current collecting holes or apertures H
2
are formed through the substrate, lower electrode layer and the first connecting electrode layer. Subsequently, a photoelectric conversion layer is formed over the entire area of the substrate made of a-Si. With the opposite end portions of the substrate being covered by masks having a simple shape (e.g., rectangular shape), an upper electrode layer as a transparent electrode layer is formed on the substrate, using the above masks, so that the electrode layer does not extend over the connection holes H
1
. Then, a second connecting electrode layer is formed on the entire area of the rear surface of the substrate, such that the upper electrode layer and the second connecting electrode layer overlap each other on the inner wall of the current collecting holes H
2
, so that these layers are electrically connected with each other. Subsequently, the upper electrode layer and a laminate of the first and second connecting electrodes are subjected to laser beam machining so that the upper electrode layer is divided by parting lines L
2
into individual upper electrodes
5
e
, and the first and second connecting electrode layer are divided by parting lines L
3
into individual first and second connecting electrodes
3
e
,
6
e.
As a result of the process as described above, the unit photoelectric conversion elements are connected in series such that current flows through the second connecting electrode
6
e
and first connecting electrode
3
e
on the rear side of the substrate, lower electrode
2
e
, photoelectric conversion layer
4
p
, and upper electrode
5
e
(namely, one unit photoelectric conversion element), current collecting hole H
2
, adjacent second connecting electrode
6
en
and first connecting electrode
3
en
, connecting hole H
1
lower electrode
2
en
, photoelectric conversion layer
4
pn
and upper electrode
5
en
(namely, adjacent unit photoelectric conversion element), in the order of description.
In the known SCAF type photoelectric conversion apparatus as described above, the total area of the connecting holes and collecting holes that are non-power-generating regions can be made considerably smaller than the area of the unit photoelectric conversion elements and the area of the substrate, and therefore the ratio of the non-power-generating area to the overall substrate area, namely, area loss, can be considerably reduced. Also, the electrodes at the opposite ends of the series-connected unit photoelectric conversion elements, namely, external lead electrodes between which the output voltage is established, are located on the rear surface of the substrate, and thus do not provide non-power-generating regions, which greatly contributes to a reduction in the area loss. Furthermore, external leads are connected to the external lead electrodes on the rear surface, thus avoiding an increase in the non-power-generating region.
Another known example of photoelectric conversion apparatus similarly intended for a reduction in the area loss is disclosed in Japanese Patent No. 2,647,892. In this photoelectric conversion apparatus, a second rear electrode film, insulating film, first rear electrode film, semiconductor film and a light-receiving side electrode film are laminated in this order on a substrate. The electrical connection between the light-receiving side electrode film and the second rear electrode film is established through a contact hole formed through the insulating film, first rear electrode film and the semiconductor film, and electrical connection between the first rear electrode film and second rear electrode film is established through another contact hole formed through the insulating film, so that the unit photoelectric conversion elements are connected in series. In this photoelectric conversion apparatus, the second rear electrode film and the unit photoelectric conversion elements are disposed on the same surface of the substrate. Since the second rear electrode film provides output electrodes for connection with leads at the opposite ends of the series-connected unit photoelectric conversion elements, external leads

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