Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2006-04-18
2006-04-18
Chen, Kin-Chan (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
C438S754000, C257S444000
Reexamination Certificate
active
07030032
ABSTRACT:
A method for passivating a photodiode so as to reduce dark current, Isdark, due to the exposed semiconductor material on the sidewall of the device. The method includes etching away sidewall surface damage using a succinic acid-hydrogen peroxide based sidewall etch. This is followed by a subsequent hydrochloric acid (HCl)-based surface treatment which completes the surface treatment and reduces the dark current Isdark. Finally, a polymer coating of benzocyclobutene (BCB) is applied after the surface treatment to stabilize the surface and prevent oxidation and contamination which would otherwise raise the dark current were the diodes left with no coating. The BCB is then etched away from the contact pad areas to allow wirebonding and other forms of electrical contact to the diodes. Such method effectively stabilizes the etched surfaces of photodiodes resulting in significantly reduced and stable dark current.
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Marsh Philbert Francis
Whelan Colin Steven
Chen Kin-Chan
Daly, Crowley & Mofford & Durkee, LLP
Raytheon Company
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