Photodiode for multiple wavelength operation

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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Details

C257S434000, C257S760000, C438S048000, C438S142000, C438S208000

Reexamination Certificate

active

07956432

ABSTRACT:
A photodiode includes a substrate having a first semiconductor type surface region on at least a portion thereof, and a second semiconductor type surface layer formed in a portion of the surface region. A multi-layer anti-reflective coating (ARC) is on the second semiconductor type surface layer, wherein the multi-layer ARC comprises at least two different dielectric layers. A layer resistant to oxide etch is above a peripheral portion the multi-layer ARC. Further layers are above the layer resistant to oxide etch, and thereby above the peripheral portion the multi-layer ARC. A window extends down to the multi-layer ARC. A photodiode region is formed by a pn-junction of the first semiconductor type surface region and the second semiconductor type surface layer.

REFERENCES:
patent: 6743652 (2004-06-01), Thomas et al.
patent: 2004/0012021 (2004-01-01), Hosokawa et al.
patent: 2005/0186754 (2005-08-01), Kim
patent: 2005/0287479 (2005-12-01), Moon
patent: 2003-163344 (2003-06-01), None
patent: 2004-047544 (2004-02-01), None
Fukunaga, et al., “SI-OEIC (OPIC) for Optical Pickup,” IEEE Transactions on Consumer Electronics, vol. 43, No. 2, May 1997, pp. 157-164.
Ghazi et al., “CMOS Photodiode with Enhanced Responsivity for the UV/Blue Spectral Range,” IEEE Transactions on Electron Devices, vol. 49, No. 7, Jul. 2002, pp. 1124-1128.
Zimmerman et al., “Advanced Photo Integrated Circuits in CMOS Technology”, 49th Electronic Components and Technology Conference, San Diego, Jun. 1-4, 1999, USA, pp. 1030-1035.

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