Photodetector-to-substrate bonds

Details Photodetector-to-substrate bonds Photodetector-to-substrate bonds

1976-07-23

1977-08-02

Whitehead, Harold D.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228124, 228263, 29572, H01G 920

Patent

active

040391167

ABSTRACT:
A photodetector is bonded to an electrically conductive substrate with an indium containing solder. An electrical insulating layer of a stable oxide which is wettable by indium provides electrical insulation between the electrically conductive substrate and the photodetector.

REFERENCES:
patent: 2779685 (1957-01-01), Teves et al.
patent: 3533850 (1970-10-01), Tarneja et al.
Engel, IBM Technical Disclosure Bulletin, vol. 4, No. 8, p. 59, Jan. 1962.
Giedd et al., IBM Technical Disclosure Bulletin, vol. 11, No. 2, p. 117, July 1968.

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