Photocurable/therosetting resin composition, photosensitive...

Radiation imagery chemistry: process – composition – or product th – Imaged product – Multilayer

Reexamination Certificate

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C430S285100, C430S287100, C522S100000, C522S101000, C522S103000

Reexamination Certificate

active

10980190

ABSTRACT:
A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.

REFERENCES:
patent: 6190833 (2001-02-01), Shiota et al.
patent: 6338936 (2002-01-01), Ichikawa et al.
patent: 6361924 (2002-03-01), Yabuuchi et al.
patent: 6893784 (2005-05-01), Kohiyama et al.
patent: 1 074 888 (2001-02-01), None
patent: 1275665 (2003-01-01), None
patent: 01-203424 (1989-08-01), None
patent: 07-330865 (1995-12-01), None
patent: 09-255741 (1997-09-01), None
patent: 11-065116 (1999-03-01), None
patent: 11-106380 (1999-04-01), None
patent: 11-246541 (1999-09-01), None
patent: 11-322944 (1999-11-01), None
patent: 11-343346 (1999-12-01), None
patent: WO 02/23273 (2001-09-01), None
patent: WO 01/72857 (2001-10-01), None
Kazuaki et al, machin translation of JP 11-65116 translated by machine online translation from Japan Patent Office, 23 pages and English abstract from Japanese patent Office with publication date Mar. 1999.
Monroe, et al, “Photoinitiators for Free-Radical-Initiated photoimaging Systems”, Chem. Rev. 1993, vol. 93, pp. 435-448.
Abe Youichi, “Current Status and Updates on Radiation Curing Resin for Coating Technology”, DIC Technical Review. No. 11, 2005, pp. 1 and 8.
S. Peter PAPPAS,“UV Curing: Science and Technology”,A Technology Marketing Publication.

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