Photocurable thermosettting resin composition developable with a

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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4302801, 4302861, 4302871, 522 37, 522 40, 522 42, 522 43, 522 44, 522 45, 522 46, 522 53, 522 63, 522 64, 522 79, 522 80, 522100, 522103, C08G 5914, C08G 5917, C09D16302

Patent

active

059485140

ABSTRACT:
A photocurable and thermosetting resin composition developable with an aqueous alkali solution is disclosed. The composition comprises in combination: (A) a photosensitive prepolymer soluble in a dilute aqueous alkali solution obtained by esterifying an epoxy resin represented by the following general formula (1) with (meth)acrylic acid and further adding an acid anhydride thereto until an acid value reaches a level in the range of 60 to 120 mg KOH/g, (B) a diglycidyl ether type epoxy compound containing two epoxy groups in the molecular unit thereof, (C) a photopolymerization initiator, and (D) a diluent at such ratios of combination that said epoxy compound (B) accounts for a proportion in the range of 5 to 120 parts by weight and said photopolymerization initiator (C) for a proportion in the range of 0.1 to 30 parts by weight, based on 100 parts by weight of said photosensitive prepolymer (A): ##STR1## wherein X represents CH.sub.2, C(CH.sub.3).sub.2, or SO.sub.2, n is an average value in the range of 1 to 12, and Y represents a hydrogen atom or a glycidyl group, providing that Y is a glycidyl group where n is 1 and at least one of the plurality of Y's is a glycidyl group where n is 2 or more.

REFERENCES:
patent: 4789620 (1988-12-01), Sasaki et al.
patent: 4970135 (1990-11-01), Kushi et al.
patent: 5304628 (1994-04-01), Kinoshita et al.
patent: 5319060 (1994-06-01), Nishikawa et al.
patent: 5538821 (1996-07-01), Kakinuma et al.

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