Photocurable/thermosetting resin composition, photosensitive...

Radiation imagery chemistry: process – composition – or product th – Stripping process or element – Forming nonplanar image

Reexamination Certificate

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C430S260000, C430S280100

Reexamination Certificate

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06844130

ABSTRACT:
A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.

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Publication No. 09255741, publication date Sep. 30, 1997, Applicant Tamura Kaken KK, one page English Abstract of JP 09-25574 copyright 1997 Patent Abstracts of Japan, JPO(presented by applicants).*
Machine Translation into English from Japanese Patent Office website www19.ipdl.jpo.go.jp of JP 09-255741, 28 pages submitted by applicant.*
Kazuaki et al , machine translation of JP 11-065116 translated by machine online translation from Japan Patent Office, 23 pag and English Abstract already cited by applicants date of publication Mar. 1999.*
International Search Report no further information cited.
International Preliminary Examination Report Jan. 31, 2002.
Supplemental European Search Report dated Mar. 27, 2003.

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