Photocurable formulation containing a partially polymerized divi

Details Photocurable formulation containing a partially polymerized divi Photocurable formulation containing a partially polymerized divi

1995-06-05

1999-03-16

Codd, Bernard

Radiation imagery chemistry: process, composition, or product th

Diazo reproduction, process, composition, or product

Composition or product which contains radiation sensitive...

4302861, 4302871, 522 65, 522 99, G03C 152, C08C 248

Patent

active

058828362

ABSTRACT:
A photocurable formulation containing a partially polymerized DVS resin formed by heating DVS monomer disiloxane) in a solvent at an initial concentration of DVS monomer in the solvent of from about 12 to about 32 weight percent. This photocurable formulation may be used as an interlayer dielectric to fabricate thin film multichip modules.

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