Photocurable and thermosetting matte liquid resist composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...

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522129, 522146, C08J 328

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active

057537224

ABSTRACT:
A photocurable and thermosetting matte liquid resist composition developable with an aqueous alkali solution is disclosed. The composition comprises in combination (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photopolymerization initiator, (C) a diluent, (D) an epoxy compound having at least two epoxy groups in the molecular unit thereof, and further (E) a finely pulverized aluminum silicate matting agent in combination with (F) a filler precipitation preventing agent capable of effective thixotropic adjustment in the composition. The composition may further comprise (G) an epoxy resin curing agent. The composition can be advantageously used for the formation of a solder resist on a printed circuit board.

REFERENCES:
patent: 5183831 (1993-02-01), Bielat et al.
patent: 5596023 (1997-01-01), Tsubota et al.

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