Photocoupler device with light-transmissive resin including fill

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

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257 82, 257787, 257789, 257794, H01L 2715

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active

057708673

ABSTRACT:
A photocoupler device includes a light-emitting chip, a light-receiving chip, a light-emitting side lead frame for individually holding the light emitting chip and a light-receiving side lead frame for individually holding the light-receiving chip. The light-emitting and light-receiving chips are opposed to each other so as to be optically coupled and covered with a light-transmissive resin as a first molding layer, in the whole part except in the outside connecting terminal portions of the two lead frames. The first molding layer is further covered with an opaque resin as a second molding layer. In such a photocoupler device, the light-transmissive resin is made to contain fillers in an amount of 80% by weight or more and directly cover the light-emitting chip, without needing silicone-resin coating for protecting the light-emitting chip.

REFERENCES:
patent: 4412135 (1983-10-01), Awaji
Patent Abstracts of Japan, vol. 17, No. 661 (E-1471), Dec. 7, 1993, JP 05 218493 A (Shapr Corp), Aug. 27, 1993.
Patent Abstracts of Japan, vol. 12, No. 293 (E-645), Aug. 10, 1988, JP 63 070445 A (Nitto Electric Ind Co Ltd), Mar. 30, 1988.
Patent Abstracts of Japan, vol. 10, No. 213 (E-422), Jul. 25, 1986, JP 61 051853 A (Mitsubishi Electric Corp), Mar. 14, 1986.
Patent Abstracts of Japan, vol. 17, No. 689 (C-1143), Dec. 16, 1993, JP 05 230178 A (Matsushita Electric Work Ltd), Sep. 7, 1993.

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