Photo-sensor fiber-optic stress analysis system

X-ray or gamma ray systems or devices – Specific application – Diffraction – reflection – or scattering analysis

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378 71, G01N 2320

Patent

active

058287248

ABSTRACT:
An x-ray diffraction system for determining stress in integrated circuit materials includes a source of x-rays (3) that are directed toward a sample holding mechanism for diffracting from the test sample (8). An x-ray detector (14) is arranged for detecting high back reflected diffracted x-ray intensity data representing stress in the test sample. A two-dimensional detection and storage arrangement (24) is arranged for detecting and storing the data representing stress in the test sample. A data processor (2) accesses the stored data from the two-dimensional detection and storage arrangement and processes the data representing stress in the test sample to determine stress in the test sample.

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Noyan, I.C. and Cohen, J.B., "Residual Stress," Springer-Verlag, ISBN 0-387-96378-2, (1987), pp. 4-7, 74-110, and 116-125.
Noyan, I. C. and Goldsmith, C.C., "Thermal Stress Relaxation in Vapor Deposited Thin Films," Advances in X-ray Analysis, 34, 587, (1991).
Crowder, C.E. et al., "The Measurement of Triaxial Residual Stress in Polymer-Coated Aluminum Circuitry in Microchip Modules," Advances in X-ray Analysis, 36, 231, (1993).

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