Photo-sensor fiber-optic stress analysis system

X-ray or gamma ray systems or devices – Specific application – Diffraction – reflection – or scattering analysis

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378 72, 378 87, G01N 2304

Patent

active

060581603

ABSTRACT:
An x-ray diffraction system for determining stress in integrated circuit materials includes a source of x-rays (3) that are directed toward a sample holding mechanism for diffracting from the test sample (8). An x-ray detector (14) is arranged for detecting high back reflected diffracted x-ray intensity data representing stress in the test sample. A two-dimensional detection and storage arrangement (24) is arranged for detecting and storing the data representing stress in the test sample. A data processor (2) accesses the stored data from the two-dimensional detection and storage arrangement and processes the data representing stress in the test sample to determine stress in the test sample.

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Crowder, C.E. et al., "The Measurement of Triaxial Residual Stress in Polymer-Coated Aluminum Circuitry in Microchip Modules," Advances in X-ray Analysis, 36, 231, (1993).
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