Photo-sensitive MEMS structure

Details Photo-sensitive MEMS structure Photo-sensitive MEMS structure

2008-01-29

2008-01-29

Ha, Nguyen T. (Department: 2831)

Electricity: electrical systems and devices

Electrostatic capacitors

Variable

C361S272000, C361S277000, C361S283300, C361S290000, C361S292000

Reexamination Certificate

active

11036438

ABSTRACT:
A heat-sensitive apparatus includes a substrate with a top surface, one or more bars being rotatably joined to the surface and having bimorph portions, and a plate rotatably joined to the surface and substantially rigidly joined to the one or more bars. Each bimorph portion bends in response to being heated. The one or more bars and the plate are configured to cause the plate to move farther away from the top surface in response to the one or more bimorph portions being heated.

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