Photo resist film application mechanism

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se

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Details

156517, 156521, 156542, 156541, 156518, 156519, B32B 3100

Patent

active

053285468

ABSTRACT:
A dry film photoresist laminator includes a punch and die assembly 24 which punches a rolled sheet dry film photoresist material 14, that is comprised of a dry film photoresist material 18 sandwiched between a Mylar top layer 16 and a polyolefin bottom layer 20, into photoresist decals. The photoresist decals are bonded to a tacky transport tape 40 which carries the decals to a polyolefin peeler assembly 54 that rolls a high tack tape 57 along the polyolefin layer 20 of the decal, thereby peeling it from the decal. The decal is advanced by a laminating assembly 44 which rolls the decal onto a heated wafer 72, thereby bonding the exposed photoresist material 18 to the wafer 72. Bonded wafer 72 and decal 14 are removed from the transport tape 40. A tape transport assembly 44 carrying the transport tape and decal is advanced through the various process steps.

REFERENCES:
patent: 4075051 (1978-02-01), Brzozowski
patent: 4273859 (1981-06-01), Mones et al.
patent: 4338152 (1982-07-01), Del Bianco et al.
patent: 4491492 (1985-01-01), Hetherington
patent: 4495014 (1985-01-01), Gebrian et al.
patent: 4714504 (1987-12-01), Cummings et al.
patent: 4921566 (1990-05-01), Stork
patent: 5106450 (1992-04-01), Freisitzer

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