Photo-plating solution and process

Details Photo-plating solution and process Photo-plating solution and process

1993-11-16

1995-06-13

Lusignan, Michael

Fishing, trapping, and vermin destroying

4274431, 4274432, 427553, 427581, H01L 2102

Patent

active

054242525

ABSTRACT:
An electroless metal or alloy plating solution as a photo-plating solution contains at least one of copper, nickel, cobalt or tin, and a sacrificial reagent which supplies electrons as a result of irreversible oxidative decomposition. A semiconductor is supported on a substrate, and dipped in the photo-plating solution, and the surface of the semiconductor is irradiated with light having a higher level of energy than the exciting energy of the semiconductor. A thick coating containing at least one of copper, nickel, cobalt or tin can be formed on that portion of the semiconductor which has been irradiated with light.

REFERENCES:
patent: 4151311 (1979-04-01), Feldstein
patent: 4359485 (1982-11-01), Donnelly
patent: 4419390 (1983-12-01), Feldstein
patent: 4472458 (1984-09-01), Sirinyan
patent: 4661372 (1987-04-01), Mance
patent: 4738869 (1988-04-01), Baumgartner
patent: 4910049 (1990-03-01), Bindra
patent: 5314725 (1994-05-01), Morishita
M. Paunovic "Electrochemical Aspects of Electroless Deposition of Metals" Plating, Nov. 1968, pp. 1161-1167.
Kirk-Othmer "Encyclopedia of Chemical Technology" vol. 8, 3rd ed. John Wiley & Sons 1979, pp. 738-741.

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