Patent
1987-05-26
1988-12-27
Corbin, John K.
350320, 350416, 350 9618, G02B 702
Patent
active
047936886
ABSTRACT:
In the photo electro device, a laser diode chip is set fixedly through a submount to a heatsink in a package. In assembling, first a ball lens is anchored to a holder of a lens support frame by clinching claws of the holder. Subsequently the surfaces of the ball lens on the obverse and reverse sides of the lens support frame are coated with nonreflective films. Then the position of the lens support frame is adjusted relatively to the laser diode chip so that the respective optical axes are aligned with each other. And after an arm is welded fixedly to the heatsink, a frame member is severed or removed to complete the work for setting the ball lens.
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Aiki Kunio
Kawabata Tsunetoshi
Kugimiya Haruo
Nemoto Tugio
Sasayama Atsushi
Ben Loha
Corbin John K.
Hitachi , Ltd.
Hitachi Tobu Semiconductor Ltd.
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