Photo diode and related method for fabrication

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S048000, C438S199000, C438S197000

Reexamination Certificate

active

07863082

ABSTRACT:
A method for fabricating a photo diode first involves providing a substrate. A doping area is then formed on the substrate. Afterwards, a dielectric layer, and a first poly-silicon layer are formed on the substrate. An opening is then formed to expose a surface of the doping area. A second poly-silicon layer is formed on the first poly-silicon layer and within the opening. The second poly-silicon layer is patterned to form a wire, while the first poly-silicon layer is patterned to form a gate. Finally, a source/drain is formed.

REFERENCES:
patent: 4808555 (1989-02-01), Mauntel et al.
patent: 6015993 (2000-01-01), Voldman et al.
patent: 6171882 (2001-01-01), Chien
patent: 6534356 (2003-03-01), Yang et al.
patent: 6756616 (2004-06-01), Rhodes
patent: 6764892 (2004-07-01), Kunz
patent: 7385238 (2008-06-01), Mouli
patent: 2005/0051702 (2005-03-01), Hong
patent: 2005/0110060 (2005-05-01), Shiu
patent: 2906930 (2007-05-01), None
patent: 10022660 (2001-11-01), None
patent: 2004/0011066 (2004-02-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Photo diode and related method for fabrication does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photo diode and related method for fabrication, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photo diode and related method for fabrication will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2652790

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.