Photo-detector for detecting image signal of infrared laser...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal

Reexamination Certificate

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C438S087000, C438S309000, C257S292000, C257SE27132

Reexamination Certificate

active

07855094

ABSTRACT:
A photo-detector, in which metal wiring for connecting electrodes is arranged on a planarized surface and thus the metal wiring arrangement is simplified, and a method of manufacturing the same are provided. The photo-detector includes a multi-layer compound semiconductor layer formed on a compound semiconductor substrate. A number of p-n junction diodes are arranged in a regular order in a selected region of the compound semiconductor layer, and an isolation region for individually isolating the p-n junction diodes is formed by implanting impurity ions in the multi-layer compound semiconductor layer. The isolation region and the surface of the compound semiconductor layer are positioned on the same level. The isolation region may be a Fe-impurity region.

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Ohnaka Kiyoshi et al; “Planar Ingaas Pin/Jfet Fiber-Optic Detector” XP002428044 Database Compendex [Online] Engineering Information, Inc., New York, NY, US: Aug. 8, 1985 Database accession No. EIX86030037895.
S.F. Kong, et al; “Electrical Isolation of MQW InGaAsP/InP Structures By MeV Iron Ion Implantation for Vertical Pin Modulators and Photodiodes”, 2004 International Conference on Indium Phosbide and Related Materials Conference Proceedings 16thIPRM, May 31-Jun. 4, 2004 Kagoshima Japan XP-010814975.
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