Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1987-05-19
1989-04-11
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 96, 427306, B05D 512
Patent
active
048205494
ABSTRACT:
A photo-curable resist resin composition for electroless plating comprising an epoxy resin having a viscosity of at least 150 poises at 25.degree. C., and at least two glycidyl ether groups in one molecule, the glycidyl ether groups being directly bonded to the aromatic ring as Component A, an oxirane ring-containing compound having a boiling point of at least 140.degree. C. and a molecular weight of not more than 500 as Component B, and a photo-sensitive aromatic onium salt as Component C, wherein the Component A is in an amount of 90 to 40 parts by weight per total 100 parts by weight of the Components A and B, and the Component C is in an amount of 0.1 to 5 parts by weight per total 100 parts by weight of the Components A and B, and, if any, other resin components, can produce a resist film capable of withstanding highly alkaline electroless copper plating solution at a high temperature for a long time without any decrease in the physical properties of plating films deposited even by repeated use of the electroless copper plating solution. The resist film prepared from the resist resin composition has distinguished soldering heat resistance, solvent resistance and electrical insulation.
REFERENCES:
patent: 3307972 (1967-03-01), Ehrhardt
patent: 4216246 (1980-08-01), Iwasaki
patent: 4297401 (1981-10-01), Chern
patent: 4401537 (1983-08-01), Chern
patent: 4550128 (1985-10-01), Chellis
patent: 4572764 (1986-02-01), Fan
patent: 4590539 (1986-05-01), Sanjana
patent: 4599268 (1986-07-01), Chellis
patent: 4689442 (1987-08-01), Ozaki
Kawamoto Mineo
Mori Atsushi
Murakami Kanji
Ozaki Kiyoshi
Tsuda Hideo
Beck Shrive
Dang Vi Duong
Hitachi , Ltd.
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