Photo-curable resin composition and process for preparing resin-

Plastic and nonmetallic article shaping or treating: processes – Stereolithographic shaping from liquid precursor

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264308, B29C 3508, B29C 4102

Patent

active

058740414

ABSTRACT:
A photo-curable resin composition suitable as a material for optical molding. The composition can produce cured products with excellent mechanical strength and high heat resistance. Further disclosed is a process for molding a resin-based mold which provides superior molding dimensional precision and superb repetition durability. The composition contains a monomer component which contains (A) 20-80 wt % of a urethane-bond polyfunctional (meth)acrylate having a number average molecular weight of 1,000 or less and (B) 80-20 wt % of an ethylenically unsaturated monomer containing a cyclic structure and at least one ethylenically unsaturated bond in the molecule and of which the homopolymer has a glass transition temperature of 50.degree. C. or higher; (C) a photopolymerization initiator; and (D) an inorganic filler having an average particle diameter or an average fiber length of 1-50 .mu.m, wherein the ratio of the inorganic filler for 100 parts by volume of said monomer components and the photopolymerization initiator is 100-160 parts by volume, and the heat distortion temperature of the cured resin produced from the photo-curable resin composition is 80.degree. C. or higher.

REFERENCES:
patent: 4575330 (1986-03-01), Hull
patent: 4942066 (1990-07-01), Fan
patent: 5002855 (1991-03-01), Fan
patent: 5175077 (1992-12-01), Grossa
patent: 5496870 (1996-03-01), Chawla et al.
Derwent Abstract 008048476, JP 1232025, Sep. 1989.
Derwent Abstract 010200745, JP 7026062, Jan. 1995.
Derwent Abstract 010200743, JP 7026060, Jan. 1995.

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