Photo-curable resin composition

Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...

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4302801, 430171, 522170, 522169, 522 15, 522 25, G03F 716, G03F 7029, G03F 7004

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active

061270857

ABSTRACT:
A novel photo-curable resin composition. The resin composition capable of providing a cured product having excellent mechanical strength, high dimensional accuracy, and excellent toughness. The resin composition is capable of providing a cured product which experiences little change in mechanical strength over time. The resin composition is capable of forming, by photo-fabricating, a three-dimensional object which can be used for a long period of time in a humid atmosphere. The composition comprises, (A) an epoxy compound having a cyclohexene oxide, (B) a cationic photo-initiator, (C) an ethylenically unsaturated monomer, (D) a radical photo-initiator, and (E) a polyol.

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13:17 344, Chemical Abstract of Japan 2-75618 issued Mar. 15, 1990, American Chemical Society.
90-127832, WPIDS, English Abstract of Japan 2-75618, issued Mar. 15, 1990, Derwent Information Ltd.
RN 87211-27-6, Registry, American Chemical Society 1998.
RN 25085-98-7, Registry, American Chemical Society, 1998.
RN 15625-89-5, Registry, American Chemical Society, 1998.
Patent Abstracts of Japan, vol. 14, No. 261 (C-0725), Jun. 6, 1990 (abstract of JP-02-075618).

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