Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-03-22
2011-03-22
Geyer, Scott B (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S110000, C257S099000
Reexamination Certificate
active
07910387
ABSTRACT:
A phosphor coating method for fabricating a light-emitting semiconductor is provided. The phosphor coating method comprises the steps as follows: First a light emitting semiconductor wafer having a plurality of die units formed thereon is provided, and a photoresist is then formed on the light emitting semiconductor wafer to cover the die units. A pattern process is conducted to form a plurality of openings associated with the die units, whereby each die can be exposed via one of the openings. Subsequently, a compound mixed with phosphor is filled into the openings.
REFERENCES:
patent: 7675075 (2010-03-01), Nagai
patent: 2007/0045761 (2007-03-01), Basin et al.
patent: 2000208822 (2000-07-01), None
Everlight Electronics Co., Ltd.
Geyer Scott B
Muncy Geissler Olds & Lowe, PLLC
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